Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jan 14, 2026～Feb 10, 2026
This ranking is based on the number of page views on our site.
1～25 item / All 25 items
This is a multifunctional bond tester developed by XYZTEC, a manufacturer specializing in bond testers.
Features ● Equipped with up to 6 types of load cells ● Continuous measurement for various tests such as wire pull and shear ● High precision measurement with an error of ±0.075% ● Wide work area ● Compatible with automatic measurement programs using pattern recognition ● Maximum load: shear 200kgf, pull 100kgf ● Customizable work holder
Ultrasonic metal-joined power module terminals and busbars, maximum 1000 kgf shear measurement compatible model for large area die shear strength testing.
This model was developed at the request of a major European power module manufacturer for measuring the shear strength of ultrasonic metal-joined power module terminals, busbars, and large-area die shares, with a shear strength exceeding 200 kgf. With a dedicated design for high load capacity, it achieves high robustness with a deflection of 100 μm under a load of 1000 kgf and a measurement accuracy of ±1%. The shear sensor is compatible with Θ rotation, allowing various directional shear tests without rotating the sample. It supports automatic measurement through an automatic measurement function with position correction via image recognition. Even during manual measurements, easy alignment is possible using a camera. It is also equipped with a function for recovering test fragments (terminals). With the optional Halcon image processing function, it can accommodate various measurements and advanced recognition through image processing. The recent renewal has achieved even higher positional accuracy and rigidity by adopting a granite chassis, and the software has also been improved. The cabinet complies with SEMI S2 standards, ensuring comprehensive safety measures.
Evaluation of internal bonding strength of paper and board.
An internal bond tester capable of accurately preparing 5 samples simultaneously at the automatic sample preparation station (included in the standard equipment).
Strength testing machine for measuring the internal bonding strength in the Z direction for paper and cardboard.
Attach a 50×50mm sample with double-sided tape on both sides to the measurement section, open the arm in the Z direction in 0.1μm increments, and measure the load required for interlayer delamination.
Adopts a high-precision microstep motor! Stable measurements are possible from ultra-low speed to high speed.
The "SS-30WD" is a multi-type strength testing machine that can accurately measure various strengths such as wire pull, die shear, and peel strength. By simply changing the installation direction of the load cell, it is possible to handle pull, peel, push, and shear tests with a single unit. By adopting a high-precision micro-stepping motor, stable measurements can be achieved from ultra-low speed to high speed. 【Features】 ■ Capable of handling pull, peel, push, and shear tests with one unit ■ Equipped with a high-precision micro-stepping motor ■ Stable measurements possible from ultra-low speed to high speed ■ The dedicated data processing software automatically captures load fluctuation graphs immediately after measurement ■ Custom solutions tailored to workpieces and measurement content, such as jigs and tools, are available *For more details, please refer to the related link page or feel free to contact us.
Quick and easy flaw detection work! Introducing a compact and lightweight high-performance flaw detector with excellent operability and durability.
At Rex Co., Ltd., we rent measuring instruments such as measuring devices and weighing instruments. The "BondMaster600" is a compact, lightweight, high-performance flaw detector that excels in operability and durability. It allows for quick and easy flaw detection in various inspections, including honeycomb sections of composite materials, joints between metals, and laminated composites. In addition to being compact and lightweight, it features a color VGA display that clearly shows eddy current signals both indoors and outdoors. 【Features】 ■ Designed to meet IP66 equivalent dust and water resistance standards ■ Excellent durability even in harsh environmental conditions ■ Long-lasting battery (up to approximately 9 hours) ■ Bright 5.7-inch (14.5 cm) color VGA display ■ Full-screen display available in all display modes *For more details, please refer to the external link page or feel free to contact us.
The versatile bond tester DAGE4000 has been completely redesigned, becoming more multifunctional and achieving higher precision, thus being reborn!
This product is a device suitable for quality control of semiconductors and electronic components for automotive applications in high-density mounting, capable of various bonding strength tests with just one unit. With a rich array of options, it allows for combinations tailored to the customer's intended use, enabling the acquisition of high-precision and highly reproducible data. Please feel free to contact us when you need assistance. 【Features】 ■ A versatile bond tester that can accommodate various bonding strength tests with one unit by exchanging load cells. ■ Compatible with MFC (Multi-Function Cartridge) that incorporates three types of sensors. ■ A variety of camera options for measurement observation are available. ■ The control software "Paragon" allows for the association and storage of photos of failure modes and measurement videos with the measurement data by using the camera options. *For more details, please download the PDF or feel free to contact us.
The standard measurement target is the thick aluminum wire bond in the post-process of power semiconductor manufacturing.
This product is a laser bond tester that can perform non-contact, non-destructive, and instantaneous measurements of aluminum wire bonds. It comes standard with a function that corrects the measurement position to an optimal location through image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections of medium lots. The measurement method is a laser periodic heating joint interface measurement method. 【Features】 ■ Automatic measurement ■ Non-contact ■ Non-destructive ■ Instantaneous measurement *For more details, please refer to the PDF materials or feel free to contact us.
We will introduce products that can be used for efficient sampling inspections and full bond inspections of medium lots.
This product is a laser bond tester designed specifically for large-diameter aluminum wire bonds with a magazine supply system. It comes standard with a function that corrects the measurement position to an optimal location through image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections for medium lots. For more details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating method for measuring bonding interfaces ■ Measurement Targets - Aluminum wire bonding interface condition - Wire diameter: φ200μm to φ400μm ■ Measurement Laser: Semiconductor laser, etc. *For more information, please refer to the PDF document or feel free to contact us.
Basic model bond tester Sigma Lite, ideal for wire pull tests and shear tests.
The basic model of the latest Sigma from Dutch company XYZTEC. By simplifying some specifications and options, we have managed to keep the initial introduction price low, while still allowing the use of the comfortable rotary measurement head (which can accommodate up to 6 types of sensors). It is also possible to propose a single-function head specification dedicated to pull tests/shear tests, and it can accommodate functional expansions after installation. While wire pull tests can be performed manually using tension gauges, variations in measurement values and failure modes can occur due to individual differences among operators. By using a bond tester, measurement variations can be eliminated, allowing for more accurate detection of product defects, and reducing uncertainties in troubleshooting during defect occurrences.
It is possible to accommodate various package styles! Achieving easier data management is possible.
The "System650" is a universal bond tester that enables easy data management through the Windows-based software "Bond Test Manager." It is equipped with an image capture function that allows monitoring of the fracture conditions after the shear test on a screen. It supports bump shear tests on 300mm wafers. 【Features】 ■ Various tests such as wire pull, ball shear, die shear, stud pull, tweezer pull, and ball pull can be performed by exchanging modules. ■ It has high accuracy and resolution that eliminates the need for module exchange for each measurement range. ■ It can accommodate various package styles. ■ Easy data management is possible through network connectivity. *For more details, please refer to the external link or feel free to contact us.
Global Standard for Micro Joint Strength Testing Machines
The bond testers from Nordson DAGE, developed and manufactured in the UK, are a global standard model that has sold over 8,000 units worldwide, popularizing strength testing in the semiconductor and SMT markets. With exceptional data accuracy and reproducibility, they have become the industry standard for joint strength testing.
Various high-precision strength tests can be performed with a single unit!
The "SS-30WD" is a device that enables various high-precision strength tests, such as wire pull tests and die shear tests, which are necessary for the inspection in the chip LED manufacturing process, all in one unit. Data management of measurement results and setting of measurement parameters can also be managed and configured using the included PC. Additionally, measurements can be conducted while heating as an option. We create various measurement jigs tailored to your measurement methods. We have delivered numerous devices for both LED development and mass production. 【Features】 ■ High reliability ■ Multiple product tests possible with one unit ■ Customizable measurement stage ■ Issuance of calibration certificates from JQA *For more details, please refer to the catalog or feel free to contact us.
We will solve your bond tester problems!!!
【Device Sales】 ■ DAGE4000 ■ DAGE5000 【Specifications】 ■ BS5KG ■ BS250R ■ CBP/TP5KG ■ WP100 ■ WP1KG ■ DS100 ■ Other Load Cells 【Regular Maintenance】 ■ Calibration of Various Load Cells 【Purchase Service】 ■ DAGE4000 ■ DAGE4000plus ■ DAGE4000HS ■ STELLAR4000
It can handle various bonding strength tests in the assembly process of various semiconductor components and electronic parts, as well as in the mounting process on substrates, all with one machine!
The long-selling DAGE4000 has been newly transformed. You can also use the 4000 load cell. It is a suitable device for manual pull and shear production bond tests, and it can be configured for simple wire pull tests, as well as upgraded for ball shear, die shear, ball pull, or tweezer pull/peel tests. Please feel free to contact us when you need assistance. 【Features】 ■ By replacing the load cell, it can accommodate various joint strength tests such as pull tests and shear tests. ■ The load cell replacement can be done in under 10 seconds using a one-touch method. ■ The tool touch-up accuracy during ball shear tests can be measured with high precision of ±1μm. ■ Device calibration can be easily performed by users using standard weights and fixtures, and the repeatability of the device can also be verified using standard weights. * For more details, please download the PDF or feel free to contact us.
Measurement of internal bonding strength of paper and cardboard
⚫ Microprocessor control ⚫ Control panel with full-color touchscreen and auxiliary buttons ⚫ Measurement range selection: ft.lb/sq.in, mJ/sq.in, J/m2 (statistical functions over 20) ⚫ Three measurement ranges with interchangeable pendulums ⚫ Reading resolution of 0.001 ft.lb (error less than 1%) ⚫ Steel robust frame designed to avoid energy loss during testing ⚫ CE mark ⚫ Automatic calibration function ⚫ Automatic pendulum release ⚫ Pneumatic fixation of sample holder ⚫ Interface: RS-232, USB
This is a bonding strength testing machine that can meet all needs, including strength tests for various electronic components, strength tests for solder joints, and strength tests for wire bonding.
- Adoption of proprietary patented technology VPM (Vertical Point Movement and Positioning) - Achieves multifunctionality, high performance, high precision, and high reproducibility - Ideal for quality control and research and development of various electronic components for semiconductors and automotive applications in high-density mounting
Standard feature for correcting to optimal measurement positions! It can be used for efficient sampling inspections and full bond inspections of medium lots.
The product is a laser bond tester capable of non-contact, non-destructive, and instantaneous measurement of gold wire bonds. It comes standard with a function to correct the measurement position to an optimal location using image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections of medium lots. For more details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating method for measuring bonding interfaces ■ Measurement Target: Gold or copper wire bonding interfaces ■ Measurement Laser: Semiconductor laser ■ Measurement Area: 300mm (X)・300mm (Y) ■ Power Supply: Three-phase AC 200V 30A/max, requires grounding (Type D), etc. *For more details, please refer to the PDF document or feel free to contact us.
Non-contact, non-destructive, and instantaneous measurement is possible! You can specify the optimal measurement position.
This product is a manual measurement laser bond tester specifically for gold or copper wire bonds. It can be used for performance evaluation, setting conditions for wire bonders, managing individual differences, sampling inspections, and testing all bonds in small lots. The measurement method is a laser periodic heating joint interface measurement method. The device safety standards comply with ISO 13849 / JIS B 9705. For further details, please contact us. 【Features】 ■ Manual measurement ■ Non-contact ■ Non-destructive ■ Instant measurement ■ Gold/copper fine diameter wire specification *For more details, please refer to the PDF document or feel free to contact us.
We will introduce products that can be used for efficient sampling inspections and full bond inspections of medium lots.
This product is a laser bond tester designed specifically for gold or copper wire bond magazine supply. It can be used for efficient sampling inspections and complete bond inspections of medium lots. It comes standard with a function that corrects to an optimal measurement position using image processing based on bond position information. For further details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating bonding interface measurement method ■ Measurement Targets - Gold/Copper wire bonding interface condition - Wire diameter: φ15μm to φ40μm ■ Measurement Laser: Semiconductor laser, etc. *For more details, please refer to the PDF materials or feel free to contact us.
Equipped with various load cells on a rotary head, there is no need for operators to replace the load cells! Ideal for quality control and condition setting of various bonding wires.
The Dutch company XYZTEC's bond tester Sigma can freely combine and mount up to six types of load cells (sensors) on its rotating head. With this single unit, it supports pull and shear tests for gold wire, pull, shear, and tweezer pull tests for aluminum wire, and pull shear tests for Al ribbon wire. There is no need for operators to change load cells (cartridges) or set range switches. This reduces work time and prevents accidents from dropping or damaging load cells. Additionally, its smooth stage operation, wide range of motion, automatic pull hook rotation function, and shear sensor's Θ rotation mechanism significantly enhance work efficiency. The utility requirement is only 100VAC (no compressed air needed). It has a proven track record of deliveries to many major semiconductor manufacturers both globally and domestically.
