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This is a multifunctional bond tester developed by XYZTEC, a manufacturer specializing in bond testers.
Features ● Equipped with up to 6 types of load cells ● Continuous measurement for various tests such as wire pull and shear ● High precision measurement with an error of ±0.075% ● Wide work area ● Compatible with automatic measurement programs using pattern recognition ● Maximum load: shear 200kgf, pull 100kgf ● Customizable work holder
We will introduce products that can be used for efficient sampling inspections and full bond inspections of medium lots.
This product is a laser bond tester designed specifically for large-diameter aluminum wire bonds with a magazine supply system. It comes standard with a function that corrects the measurement position to an optimal location through image processing based on bond position information. This allows for efficient sampling inspections and full bond inspections for medium lots. For more details, please contact us. 【Overview Specifications (Partial)】 ■ Measurement Method: Laser periodic heating method for measuring bonding interfaces ■ Measurement Targets - Aluminum wire bonding interface condition - Wire diameter: φ200μm to φ400μm ■ Measurement Laser: Semiconductor laser, etc. *For more information, please refer to the PDF document or feel free to contact us.
It is possible to accommodate various package styles! Achieving easier data management is possible.
The "System650" is a universal bond tester that enables easy data management through the Windows-based software "Bond Test Manager." It is equipped with an image capture function that allows monitoring of the fracture conditions after the shear test on a screen. It supports bump shear tests on 300mm wafers. 【Features】 ■ Various tests such as wire pull, ball shear, die shear, stud pull, tweezer pull, and ball pull can be performed by exchanging modules. ■ It has high accuracy and resolution that eliminates the need for module exchange for each measurement range. ■ It can accommodate various package styles. ■ Easy data management is possible through network connectivity. *For more details, please refer to the external link or feel free to contact us.
Global Standard for Micro Joint Strength Testing Machines
The bond testers from Nordson DAGE, developed and manufactured in the UK, are a global standard model that has sold over 8,000 units worldwide, popularizing strength testing in the semiconductor and SMT markets. With exceptional data accuracy and reproducibility, they have become the industry standard for joint strength testing.
Measurement of internal bonding strength of paper and cardboard
⚫ Microprocessor control ⚫ Control panel with full-color touchscreen and auxiliary buttons ⚫ Measurement range selection: ft.lb/sq.in, mJ/sq.in, J/m2 (statistical functions over 20) ⚫ Three measurement ranges with interchangeable pendulums ⚫ Reading resolution of 0.001 ft.lb (error less than 1%) ⚫ Steel robust frame designed to avoid energy loss during testing ⚫ CE mark ⚫ Automatic calibration function ⚫ Automatic pendulum release ⚫ Pneumatic fixation of sample holder ⚫ Interface: RS-232, USB
This is a bonding strength testing machine that can meet all needs, including strength tests for various electronic components, strength tests for solder joints, and strength tests for wire bonding.
- Adoption of proprietary patented technology VPM (Vertical Point Movement and Positioning) - Achieves multifunctionality, high performance, high precision, and high reproducibility - Ideal for quality control and research and development of various electronic components for semiconductors and automotive applications in high-density mounting
